Ultra-precision grinding and polishing technology is a type of ultra-precision processing technology. Ultra-precision processing technology refers to high-precision 

processing that exceeds or reaches the accuracy limit of this era. Ultra-precision machining is actually a relative concept, and with the general improvement of process 

technology level, different eras have different boundaries, but there is no strict unified standard. Judging from the current technological level of machining, processing with a 

machining error less than 0.01 μm and a surface roughness Ra less than 0.025 μm is usually called ultra-precision machining. Ultra-precision machining technology 

originated in the early 1960s - the United States first successfully developed an ultra-precision machining lathe in 1962. This technology emerged to meet the needs of 

modern high-tech development. It comprehensively uses the newly developed mechanical research results and new technologies such as modern electronics, computers, 

and measurement. It is a modern mechanical processing technology. Ultra-precision machining has broad market demand. For example, in the defense industry, the 

processing of gyroscopes involves a number of ultra-precision processing technologies, because the mass of the missile system's gyroscope directly affects its hit 

rate - according to relevant data, the center of mass of an Ikg gyro rotor deviates from its axis of symmetry by 0.0005 μm will cause a range error of 100m and an orbit error 

of 50m; in the information industry, chips, disks and magnetic heads on computers, magnetic drums in video recorders, photosensitive drums, optical discs and laser heads 

in copiers, polyhedrons in laser printers, inkjet The inkjet heads of printers must rely on ultra-precision processing to meet product performance requirements: among civilian 

products, modern small and ultra-small imaging equipment, such as micro cameras, pinhole cameras, etc., also rely on ultra-precision processing technology.

The ultra-precision machining technology we refer to includes, in addition to ultra-precision grinding and polishing technology, ultra-precision grinding, ultra-fine machining, 

smooth machining and finishing machining. These ultra-precision machining methods can process dimensional accuracy, shape accuracy and surface roughness that cannot 

be achieved by ordinary precision machining.

However, the realization of ultra-precision cutting and ultra-precision grinding relies heavily on processing equipment and processing tools. It is also affected and restricted 

by processing principles and environmental factors. Therefore, if you want to improve processing accuracy from these aspects, , that is very difficult. Ultra-precision grinding 

and polishing technology has become an important part of ultra-precision processing technology because it has unique processing principles and can achieve nano-level or 

even atomic-level processing. Therefore, ultra-precision grinding and polishing technology has attracted much attention nowadays.

Grinding and polishing are the oldest traditional crafts. Ancient stone tools, jades and bronze mirrors were made through grinding and polishing. Grinding and polishing has 

been a precision processing method since ancient times, but its development has been very slow over the years. It was not until the 1950s that the rapidly developing 

electronics industry brought a new dawn to the ancient grinding and polishing technology.

Ultra-precision grinding and polishing technology generally refers to the use of grinding powder with a particle size of only a few nanometers as grinding abrasives and 

injecting it into

Lapping tools are used to remove trace amounts of workpiece material to achieve a certain geometric accuracy (generally the error is below 0.1μm) and surface roughness 

(generally Ra≤0.01μm).

There are two main types of technical goals. One is to pursue the goal of reducing surface roughness or improving dimensional accuracy. The second is to achieve the 

function of functional material components, which requires solving the problem of surface roughness and extremely small matching with high precision. Metamorphic layer 

problem. In addition, for the processing of single crystal materials, flatness, thickness, and orientation accuracy of the crystal phase are also required. For the processing of 

electronic materials, in addition to requiring high shape accuracy, it must also achieve a physically or crystallographically damage-free ideal mirror surface.

With the development of science and technology, various interdisciplinary systems such as optics, mechanics, and electronics are manufactured. In order to ensure the high 

quality and high performance of key components in the system, people have increasingly higher requirements for processing accuracy. The use of ultra-precision grinding 

and polishing technology can not only obtain high performance of electronic, optical, and computer components, but also produce crystal substrates such as silicon wafers 

and crystal oscillator substrates for large-scale integrated circuits, which can meet the needs of special materials with extremely small surface roughness and extremely In 

addition to high flatness and ultra-smooth surface requirements, it can also achieve high performance such as strictly parallel end surfaces of the material and no 

deterioration layer on the surface, and ultimately achieve nanometer-level or higher processing accuracy and damage-free surface processing quality. It is precisely because 

of its unique strengths that ultra-precision surface grinding and polishing technology is used in the final processing of many materials.

With the development of ultra-precision surface grinding and polishing technology, major breakthroughs have been made in research on grinding methods, grinding 

principles, and grinding equipment. Now the processing accuracy can reach sub-nanometer or even nanometer-level precision, and meet different requirements for different 

materials. Many innovative grinding and polishing methods and equipment tools have been developed. However, ultra-precision grinding and polishing technology cannot 

be regarded as an isolated processing method and a simple process problem. In modern processing, the problem should be grasped from the perspective of the overall 

project. To achieve ultra-precision surface grinding and polishing, not only ultra-precision equipment and tools, ultra-stable environmental conditions, but also experienced 

workers and skilled processing technology are required. Only by bringing together technical achievements in various fields can it be possible. We anticipate the requirements.