Ultra-precision grinding and polishing technology is a type of ultra-precision processing technology. Ultra-precision processing technology refers to high-precision processing 

that exceeds or reaches the accuracy limit of this era. Ultra-precision machining is actually a relative concept, and with the general improvement of process technology level, 

different eras have different boundaries, but there is no strict unified standard. Judging from the current technological level of machining, processing with a machining error 

less than 0.01 μm and a surface roughness Ra less than 0.025 μm is usually called ultra-precision machining. Ultra-precision machining technology originated in the early 

1960s - the United States first successfully developed an ultra-precision machining lathe in 1962. This technology emerged to meet the needs of modern high-tech 

development. It comprehensively uses the newly developed mechanical research results and new technologies such as modern electronics, computers, and measurement. 

It is a modern mechanical processing technology. Ultra-precision machining has broad market demand. For example, in the defense industry, the processing of gyroscopes 

involves a number of ultra-precision processing technologies, because the mass of the missile system's gyroscope directly affects its hit rate - according to relevant data, the 

center of mass of an Ikg gyro rotor deviates from its axis of symmetry by 0.0005 μm will cause a range error of 100m and an orbit error of 50m; in the information industry, 

chips, disks and magnetic heads on computers, magnetic drums in video recorders, photosensitive drums, optical discs and laser heads in copiers, polyhedrons in laser printers, 

inkjet The inkjet heads of printers must rely on ultra-precision processing to meet product performance requirements: among civilian products, modern small and ultra-small 

imaging equipment, such as micro cameras, pinhole cameras, etc., also rely on ultra-precision processing technology.

The ultra-precision machining technology we refer to includes, in addition to ultra-precision grinding and polishing technology, ultra-precision grinding, ultra-fine machining, 

smooth machining and finishing machining. These ultra-precision machining methods can process dimensional accuracy, shape accuracy and surface roughness that cannot 

be achieved by ordinary precision machining.

However, the realization of ultra-precision cutting and ultra-precision grinding relies heavily on processing equipment and processing tools. It is also affected and restricted by 

processing principles and environmental factors. Therefore, if you want to improve processing accuracy from these aspects, , that is very difficult. Ultra-precision grinding and 

polishing technology has become an important part of ultra-precision processing technology because it has unique processing principles and can achieve nano-level or even 

atomic-level processing. Therefore, ultra-precision grinding and polishing technology has attracted much attention nowadays.

Grinding and polishing are the oldest traditional crafts. Ancient stone tools, jades and bronze mirrors were made through grinding and polishing. Grinding and polishing has 

been a precision processing method since ancient times, but its development has been very slow over the years. It was not until the 1950s that the rapidly developing 

electronics industry brought a new dawn to the ancient grinding and polishing technology.

Ultra-precision grinding and polishing technology generally refers to the use of grinding powder with a particle size of only a few nanometers as grinding abrasives and 

injecting it into

Lapping tools are used to remove trace amounts of workpiece material to achieve a certain geometric accuracy (generally the error is below 0.1μm) and surface roughness 

(generally Ra≤0.01μm).

There are two main types of technical goals. One is to pursue the goal of reducing surface roughness or improving dimensional accuracy. The second is to achieve the function 

of functional material components, which requires solving the problem of surface roughness and extremely small matching with high precision. Metamorphic layer problem. In 

addition, for the processing of single crystal materials, flatness, thickness, and orientation accuracy of the crystal phase are also required. For the processing of electronic 

materials, in addition to requiring high shape accuracy, it must also achieve a physically or crystallographically damage-free ideal mirror surface.

With the development of science and technology, various interdisciplinary systems such as optics, mechanics, and electronics are manufactured. In order to ensure the high 

quality and high performance of key components in the system, people have increasingly higher requirements for processing accuracy. The use of ultra-precision grinding and 

polishing technology can not only obtain high performance of electronic, optical, and computer components, but also produce crystal substrates such as silicon wafers and 

crystal oscillator substrates for large-scale integrated circuits, which can meet the needs of special materials with extremely small surface roughness and extremely In addition 

to high flatness and ultra-smooth surface requirements, it can also achieve high performance such as strictly parallel end surfaces of the material and no deterioration layer on 

the surface, and ultimately achieve nanometer-level or higher processing accuracy and damage-free surface processing quality. It is precisely because of its unique strengths 

that ultra-precision surface grinding and polishing technology is used in the final processing of many materials.

With the development of ultra-precision surface grinding and polishing technology, major breakthroughs have been made in research on grinding methods, grinding principles, 

and grinding equipment. Now the processing accuracy can reach sub-nanometer or even nanometer-level precision, and meet different requirements for different materials. 

Many innovative grinding and polishing methods and equipment tools have been developed. However, ultra-precision grinding and polishing technology cannot be regarded 

as an isolated processing method and a simple process problem. In modern processing, the problem should be grasped from the perspective of the overall project. To achieve 

ultra-precision surface grinding and polishing, not only ultra-precision equipment and tools, ultra-stable environmental conditions, but also experienced workers and skilled 

processing technology are required. Only by bringing together technical achievements in various fields can it be possible. We anticipate the requirements.